Thermal processing of a copper‐poly(phenyl quinoxaline) interface: Diffusion of the metal in the polymer studied by high resolution electron‐energy‐loss spectroscopy-Reference-Cited by-同舟云学术

Thermal processing of a copper‐poly(phenyl quinoxaline) interface: Diffusion of the metal in the polymer studied by high resolution electron‐energy‐loss spectroscopy

Published:1993-06-07 Issue:23 Volume:62 Page:2938-2940
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Fontaine M.,Layet J. M.,Grégoire Ch.,Pireaux J. J.,Cros A.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.109203

Reference24 articles.

1. Substrate effects on the electronic structure of metal overlayers—an XPS study of polymer-metal interfaces

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3. Reactions at the polyimide-metal interface

4. Cr‐ and Cu‐polyimide interface: Chemistry and structure

5. A study of the chemical and physical interaction between copper and polyimide

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