Cr‐ and Cu‐polyimide interface: Chemistry and structure
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.98373
Reference7 articles.
1. Metal‐polymer interfaces: Adhesion and x‐ray photoemission studies
2. Interfacial reaction during metallization of cured polyimide: An XPS study
3. Chemical bonding and reaction at metal/polymer interfaces
4. Metal polyimide interface: A titanium reaction mechanism
5. Synchrotron‐radiation excited carbon 1s photoemission study of Cr/organic polymer interfaces
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