A study of the chemical and physical interaction between copper and polyimide-Reference-Cited by-同舟云学术

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A study of the chemical and physical interaction between copper and polyimide

Published:1989-05 Issue:3 Volume:7 Page:1402-1412
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Shih D‐Y.,Paraszczak J.,Klymko N.,Flitsch R.,Nunes S.,Lewis J.,Yang C.,Cataldo J.,McGouey R.,Graham W.,Serino R.,Galligan E.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.576293

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Highly stable lithium-ion battery anode with polyimide coating anchored onto micron-size silicon monoxide via self-assembled monolayer;Journal of Power Sources;2020-03

2. Fabrication of a Bilayer Structure of Cu and Polyimide To Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices;ACS Applied Materials & Interfaces;2018-12-03

3. Cu-Oxide-Assisted Selective Pyrolysis of Organic Nanolayer on Patterned SiO2–Cu Surface;ACS Applied Materials & Interfaces;2015-07-31

4. Thermal stability of copper on Te–Ti thin films;Materials Letters;2013-12

5. Thermal stability of tungsten–titanium diffusion barriers for silver metallization;Thin Solid Films;2008-09

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