Fabrication of a Bilayer Structure of Cu and Polyimide To Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices-Reference-Cited by-同舟云学术

Fabrication of a Bilayer Structure of Cu and Polyimide To Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices

Published:2018-12-03 Issue:51 Volume:10 Page:44589-44602
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Kubo Yugo¹^ORCID,Tanaka Hirokazu¹,Saito Yoshihiro¹,Mizoguchi Akira¹

Affiliation:

1. Analysis Technology Research Center, Sumitomo Electric Industries, Ltd., 1-1-3 Shimaya, Konohana-ku, Osaka-shi, Osaka 554-0024, Japan

Funder

Ministry of Education, Culture, Sports, Science and Technology

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b15835

Reference47 articles.

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3. Conformable, flexible, large-area networks of pressure and thermal sensors with organic transistor active matrixes

4. Epidermal Electronics

5. Ultrathin conformal devices for precise and continuous thermal characterization of human skin

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