Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1591232
Reference9 articles.
1. Materials aspects of copper interconnection technology for semiconductor applications
2. Gas‐phase transport of WF6 through annular nanopipes in TiN during chemical vapor deposition of W on TiN/Ti/SiO2 structures for integrated circuit fabrication
3. Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization
4. Diffusion of Metals in Silicon Dioxide
5. Structure of 3-aminopropyl triethoxy silane on silicon oxide
Cited by 107 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A healable amino silane self-assembled monolayer incorporating polymer capped palladium nanoclusters and its application as the copper diffusion barrier layer on silicon wafer;Next Materials;2024-07
2. Nanomolecularly-induced Effects at Titania/Organo-Diphosphonate Interfaces for Stable Hybrid Multilayers with Emergent Properties;ACS Applied Nano Materials;2024-05-03
3. CuTi as Potential Liner- and Barrier-Free Interconnect Conductor;IEEE Transactions on Electron Devices;2024-05
4. Silatrane-Based Molecular Nanolayers as Efficient Diffusion Barriers for Cu/SiO2/Si Heterojunctions: Implications for Integrated Circuit Manufacturing;ACS Applied Nano Materials;2024-02-19
5. Effects of molecular assembly on heterogeneous interactions in electronic and photovoltaic devices;Chemical Physics Reviews;2024-01-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3