Nanomolecularly-induced Effects at Titania/Organo-Diphosphonate Interfaces for Stable Hybrid Multilayers with Emergent Properties-Reference-Cited by-同舟云学术

Nanomolecularly-induced Effects at Titania/Organo-Diphosphonate Interfaces for Stable Hybrid Multilayers with Emergent Properties

Published:2024-05-03 Issue:10 Volume:7 Page:11225-11233
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Rowe Collin¹,Kashyap Ankit²,Sharma Geetu¹,Goyal Naveen³,Alauzun Johan G.⁴,Barry Seán T.⁵,Ravishankar Narayanan³,Soni Ajay²^ORCID,Eklund Per⁶^ORCID,Pedersen Henrik⁶^ORCID,Ramanath Ganpati¹⁶^ORCID

Affiliation:

1. Materials Science & Engineering Department, Rensselaer Polytechnic Institute, Troy, New York 12180, United States

2. School of Physical Sciences, Indian Institute of Technology Mandi, Mandi, Himachal Pradesh 175005, India

3. Materials Research Centre, Indian Institute of Science, Bangalore, Karnataka 560012, India

4. Institut Charles Gerhardt, University of Montpellier, CNRS, ENSCM, 34293 Montpellier, France

5. Department of Chemistry, Carleton University, Ottawa, Ontario K1S 5B6, Canada

6. Department of Physics, Chemistry, and Biology, Linköping University, SE-58183 Linköping, Sweden

Funder

Vetenskapsr?det

Knut och Alice Wallenbergs Stiftelse

Department of Science and Technology, Ministry of Science and Technology, India

Division of Civil, Mechanical and Manufacturing Innovation

Stiftelsen f?r Milj?strategisk Forskning

Natural Sciences and Engineering Research Council of Canada

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.4c00743

Reference51 articles.

1. Engineering inorganic interfaces using molecular nanolayers

2. Annealing-induced interfacial toughening using a molecular nanolayer

3. Bonding-induced thermal conductance enhancement at inorganic heterointerfaces using nanomolecular monolayers

4. Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization

5. Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits