Author:
Fan J.,Tu L. C.,Tan C. S.
Subject
General Physics and Astronomy
Cited by
4 articles.
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1. Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer;Advanced Materials Interfaces;2021-01-15
2. Low temperature bonding of heterogeneous materials using Al2O3 as an intermediate layer;Integrated Optics: Devices, Materials, and Technologies XXII;2018-02-23
3. Low temperature bonding of heterogeneous materials using Al2O3 as an intermediate layer;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2018-01
4. Preface: Micro-Nano Technology;AIP Advances;2014-03