Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer-Reference-Cited by-同舟云学术

Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Published:2021-01-15 Issue:5 Volume:8 Page:2001741
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Takeuchi Kai¹,Mu Fengwen²^ORCID,Matsumoto Yoshiie³,Suga Tadatomo¹

Affiliation:

1. Collaborative Research Center Meisei University Hodokubo Hino Tokyo 1918506 Japan

2. High‐Frequency High‐Voltage Device and Integrated Circuits R&D Center Institute of Microelectronics, Chinese Academy of Sciences Beijing 100029 China

3. Lantechnical Service Co., Ltd. Takasaki Gunma 3703523 Japan

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202001741

Reference45 articles.

1. Optofluidic biomolecule sensors based on a-Si:H microrings embedded in silicon–glass microchannels

2. Low temperature bonding for microfabrication of chemical analysis devices

3. Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process

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