Stress relaxation during thermal cycling in metal/polyimide layered films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.341999
Reference9 articles.
1. Interfacial reaction during metallization of cured polyimide: An XPS study
2. Cr‐ and Cu‐polyimide interface: Chemistry and structure
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4. Synchrotron‐radiation excited carbon 1s photoemission study of Cr/organic polymer interfaces
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