Role of W and Mn for reliable 1X nanometer-node ultra-large-scale integration Cu interconnects proved by atom probe tomography
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4896961
Reference35 articles.
1. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
2. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
3. T. Iwasaki , Computational Mechanics ( Springer-Verlag, Berlin Heidelberg, 2000), p. 78.
4. Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization
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