In situobservation of electromigration-induced void migration in dual-damascene Cu interconnect structures
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1795978
Reference25 articles.
1. Electromigration reliability issues in dual-damascene Cu interconnections
2. Electromigration Performance of Multi-level Damascene Copper Interconnects
3. X-Ray Reflectivity Study Of Exotic Materials For Electronic Applications
4. Proceedings of the IEEE IPFA Conference;Gan G. L.,2002
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