Low leakage current Cu(Ti)/SiO2 interconnection scheme with a self-formed TiOx diffusion barrier
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1468913
Reference11 articles.
1. Generic linear RC delay modeling for digital CMOS circuits
2. Mechanical and Dielectric Properties of Low Permittivity Dielectric Materials
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4. Diffusion of Metals in Silicon Dioxide
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