Adhesion between Copper and Amorphous Silica: A Reactive Molecular Dynamics Study
Author:
Affiliation:
1. Innovative Technology Research Center, AGC Inc., Yokohama 221-8755, Japan
2. New Product R&D Center, AGC Inc., Yokohama 221-8755, Japan
Publisher
American Chemical Society (ACS)
Subject
Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.8b09990
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