Effects of oxygen in TiNxon the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.104610
Reference16 articles.
1. TiN as a diffusion barrier in the Ti-Pt-Au beam-lead metal system
2. High‐temperature contact structures for silicon semiconductor devices
3. Degradation Mechanism in Si-Doped Al/Si Contacts and an Extremely Stable Metallization System
4. Investigation of titanium—nitride layers for solar-cell contacts
5. Thermal stability of titanium nitride for shallow junction solar cell contacts
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