Thermal stability of titanium nitride for shallow junction solar cell contacts
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.329283
Reference4 articles.
1. Diffusion barriers in thin films
2. TiN and TaN as diffusion barriers in metallizations to silicon semiconductor devices
3. TiN as a diffusion barrier in the Ti-Pt-Au beam-lead metal system
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