Metal–organic atomic-layer deposition of titanium–silicon–nitride films
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.124742
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1. Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing
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4. W-B-N diffusion barriers for Si/Cu metallizations
5. Atomic layer epitaxy
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2. Investigation of Titanium Silicon Nitride: A Review;Lecture Notes in Electrical Engineering;2017-10-29
3. Atomic Layer Deposition of Silicon Nitride Thin Films: A Review of Recent Progress, Challenges, and Outlooks;Materials;2016-12-12
4. Periodic oxidation for fabricating titanium oxynitride thin films via atomic layer deposition;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2016-01
5. Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition;ECS Journal of Solid State Science and Technology;2014
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