Constitutive response of passivated copper films to thermal cycling
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1535731
Reference32 articles.
1. Thermal strain and stress in copper thin films
2. Effect of a surface layer on the stress relaxation of thin films
3. Measurement and interpretation of stress in copper films as a function of thermal history
4. Stress development and relaxation in copper films during thermal cycling
5. Thermomechanical behavior of different texture components in Cu thin films
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