Thermomechanical behavior of different texture components in Cu thin films
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
2. Measurement and interpretation of stress in copper films as a function of thermal history
3. Stress development and relaxation in copper films during thermal cycling
4. Thermal strain and stress in copper thin films
5. Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation
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