1. Simulation and Experiments of Stress Migration for Cu/low-k BEoL
2. E. T. Ogawa, J. W. McPherson, J. A. Rosal, K. J. Dickerson, T. C. Chiu, L. Y. Tsung. M. K. Jain, T. D. Ronifield, J. C. Ondrusek, and W. R. Mckee, Proceedings of 2002 IEEE 40th International Reliability Physics Symposium, (IEEE, Piscataway, NJ, 2002), p. 312.
3. K. Y. Y. Doony, R. C. J. Wang, S. C. Lin, L. J. Hung, S. Y. Lee, C. C. Chiu, D. Su, K. Wu, K. L. Young, and Y. K. Peng, Proceedings of 2003 IEEE 41th International Reliability Physics Symposium, (IEEE, Piscataway, NJ, 2003), p. 156.
4. Stress migration phenomenon in narrow copper interconnects
5. The effect of line width on stress-induced voiding in Cu dual damascene interconnects