Nanoscale stress analysis of strained-Si metal-oxide-semiconductor field-effect transistors by quantitative electron diffraction contrast imaging
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2135388
Reference13 articles.
1. Stress‐related problems in silicon technology
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4. Measurement of strain in Al–Cu interconnect lines with x-ray microdiffraction
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