Author:
Choy Jun-Ho,Kavanagh Karen L.
Subject
Physics and Astronomy (miscellaneous)
Cited by
9 articles.
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1. Electromigration failure in nanoscale copper interconnects;Electromigration in Thin Films and Electronic Devices;2011
2. Effect of pre-existing void in sub-30nm Cu interconnect reliability;2010 IEEE International Reliability Physics Symposium;2010
3. Routing and Reliability;Copper Interconnect Technology;2009
4. Conduction and Electromigration;Copper Interconnect Technology;2009
5. Diffusion and Barrier Layers;Copper Interconnect Technology;2009