1. Texture and electromigration performance in damascene interconnects formed by reflow sputtered Cu film;Abe;Journal of Vacuum Science and Technolology B,2004
2. A surface adsorption limited model of CoWBP capping barriers for sub 45nm Cu interconnects;Almog,2007
3. Damascene copper electroplating for chip interconnections;Andricacos;IBM Journal of Research and Development,1998
4. Analysis of electromigration induced early failures in Cu interconnects for 45nm node;Arnaud;Microelectronic Engineering,2010
5. Analysis of electromigration voiding phenomena in Cu interconnects;Arnaud,2006