Effect of internal stresses and microstructure of sputtered TiN films on solid‐phase reactions with Al‐Si‐Cu alloy films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.360717
Reference26 articles.
1. The use of titanium-based contact barrier layers in silicon technology
2. Reactive ion plating (RIP) with auxiliary discharge and the influence of the deposition conditions on the formation and properties of TiN films
3. Mechanisms of reactive sputtering of titanium nitride and titanium carbide II: Morphology and structure
4. Performance of titanium nitride diffusion barriers in aluminum–titanium metallization schemes for integrated circuits
5. Transmission electron microscopy studies of brown and golden titanium nitride thin films as diffusion barriers in very large scale integrated circuits
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1. Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration;Materials Science in Semiconductor Processing;2018-08
2. Nanoscale analysis on interfacial reactions in Al–Si–Cu alloys and Ti underlayer films;Journal of Applied Physics;2003-01-15
3. Evaluation of radio-frequency sputter-deposited textured TiN thin films as diffusion barriers between copper and silicon;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2002-03
4. Characterization on microstructures of tungsten/barrier metals (TiN,WN[sub x])/silicon multilayer films;Journal of Applied Physics;2002
5. Correlation between microstructure control, density and diffusion barrier properties of TiN(O) films;Microelectronic Engineering;2002-01
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