Estimation of wafer warpage profile during thermal processing in microlithography-Reference-Cited by-同舟云学术

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Estimation of wafer warpage profile during thermal processing in microlithography

Published:2005-07 Issue:7 Volume:76 Page:075111
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Tay Arthur,Ho Weng Khuen,Hu Ni,Chen Xiaoqi

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1979468

Reference18 articles.

1. Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

2. M. Quirk and J. Serda, Semiconductor Manufacturing Technology (Prentice Hall, Englewood Cliffs, NJ, 2001), p. 342.

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