Kinetics of tungsten low‐pressure chemical‐vapor deposition using WF6and SiH4studied byin situgrowth‐rate measurements
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.352757
Reference12 articles.
1. Low Pressure Chemical Vapor Deposition of Tungsten and Aluminum for VLSI Applications
2. Gas/surface reactions in the chemical vapor deposition of tungsten using WF6/SiH4 mixtures
3. Study on mechanism of selective chemical vapor deposition of tungsten usinginsituinfrared spectroscopy and Auger electron spectroscopy
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