Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371967
Reference10 articles.
1. SLT Device Metallurgy and its Monolithic Extension
2. Studies of the SLT Chip Terminal Metallurgy
3. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
4. Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
5. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
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