Transport of sputtered particles in capacitive sputter sources-Reference-Cited by-同舟云学术

Transport of sputtered particles in capacitive sputter sources

Published:2015-07-21 Issue:3 Volume:118 Page:033302
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Trieschmann Jan¹^ORCID,Mussenbrock Thomas¹

Affiliation:

1. Department of Electrical Engineering and Information Sciences, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, D-44780 Bochum, Germany

Funder

Deutsche Forschungsgemeinschaft (DFG)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4926878

Reference49 articles.

1. Principles of Plasma Discharges and Materials Processing

2. Dual frequency capacitive plasmas in Fe and Ni sputter applications: correlation of discharge properties on thin film properties

3. Multiple frequency capacitively coupled plasmas as a new technology for sputter processes

4. On the electrical asymmetry effect in large area multiple frequency capacitively coupled plasmas

5. S. Bienholz , “ Kapazitiv gekoppelte Mehrfrequenzplasmen zur Abscheidung keramischer und ferromagnetischer Schichten,” Ph.D. dissertation ( Ruhr-Universität Bochum, Bochum, Germany, 2014).

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