Hydrogel-mediated semiconductor wafer bonding
Author:
Affiliation:
1. Department of Chemical Engineering, Kyoto University, Nishikyo, Kyoto 615–8510, Japan
Funder
Japan Society for the Promotion of Science
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5096540
Reference43 articles.
1. Wafer bonding for silicon‐on‐insulator technologies
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5. Fabrication of Si/graphene/Si Double Heterostructures by Semiconductor Wafer Bonding towards Future Applications in Optoelectronics
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