Characterization of Si pn junctions fabricated by direct wafer bonding in ultra-high vacuum
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.120975
Reference12 articles.
1. Low temperature wafer direct bonding
2. Physics and chemistry of silicon wafer bonding investigated by infrared absorption spectroscopy
3. Interface charge control of directly bonded silicon structures
4. Hydrophobic silicon wafer bonding
5. Self‐propagating room‐temperature silicon wafer bonding in ultrahigh vacuum
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