Hydrophobic silicon wafer bonding
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.111070
Reference20 articles.
1. Wafer bonding for silicon‐on‐insulator technologies
2. Silicon‐to‐silicon direct bonding method
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4. Ideal hydrogen termination of the Si (111) surface
5. Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment
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