Author:
Lee Jung Shin,Hyung Kim Jun,Woo Rhee Daniel Min
Cited by
2 articles.
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1. Enabling Die-to-Wafer Hybrid Bonding for the Next Generation Advanced 3D Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. D2W Hybrid Bonding Challenges for HBM;2024 IEEE International Memory Workshop (IMW);2024-05-12