A self-referenced interferometer for in situ cryogenic wafer curvature measurements

Abstract

A self-referenced interferometer to measure time-varying curvature in mechanically unstable environments is needed in many applications. One application that demands this measurement technique with fast data acquisition, 2D sensitivity, and insensitivity to vibration is the measurement of thermal strain in thin films in operational environments. The diverging beam interferometer described here demonstrates an angular sensitivity to the local curvature using interferograms captured by a CMOS camera. Two-dimensional Fourier analysis is used to extract curvature changes. The interferometer demonstrates an experimental sensitivity to curvature changes on the order of 10−4 m−1 and is used to measure thermal stresses in a cryogenic environment of a polycrystalline titanium nitride thin film on a silicon wafer that exhibits anisotropic curvature.