FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
Author:
Affiliation:
1. Institute of Wide Band Gap Semiconductors, Xi’an Jiaotong University, Xi’an 710049, China
2. Department of Physics, Mettu University, Mettu, Ethiopia
Funder
Xi'an Jiaotong University (XJTU)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4978043
Reference35 articles.
1. An innovative process to fabricate copper/diamond composite films for thermal management applications
2. High thermal conductive diamond/Ag–Ti composites fabricated by low-cost cold pressing and vacuum liquid sintering techniques
3. High thermal conductive diamond/Cu–Ti composites fabricated by pressureless sintering technique
4. Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
5. Thermal properties of diamond/copper composite material
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