Compressive intrinsic stress originates in the grain boundaries of dense refractory polycrystalline thin films-Reference-Cited by-同舟云学术

Compressive intrinsic stress originates in the grain boundaries of dense refractory polycrystalline thin films

Published:2016-02-07 Issue:5 Volume:119 Page:055305
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Magnfält D.¹,Fillon A.²,Boyd R. D.³,Helmersson U.³^ORCID,Sarakinos K.¹^ORCID,Abadias G.²

Affiliation:

1. Nanoscale Engineering Division, Department of Physics, Chemistry and Biology (IFM), Linköping University, SE-581 83 Linköping, Sweden

2. Institut P', Département Physique et Mécanique des Matériaux, Université de Poitiers-CNRS-ENSMA, SP2MI, Téléport 2, Bd M. et P. Curie, F-86962 Chasseneuil-Futuroscope, France

3. Plasma and Coatings Physics Division, Department of Physics, Chemistry and Biology (IFM), Linköping University, SE-581 83 Linköping, Sweden

Funder

European Cooperation in Science and Technology (COST)

Vetenskapsrådet (VR)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4941271

Reference51 articles.

1. The magnetic anisotropy and spin reorientation of nanostructures and nanoscale films

2. Stress in Evaporated and Sputtered Thin Films – A Comparison

3. Local band bending and grain-to-grain interaction induced strain nonuniformity in polycrystalline CdTe films

4. The intrinsic stress of polycrystalline and epitaxial thin metal films

5. Stress and strain in polycrystalline thin films

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