Evaluation of integrity and barrier performance of atomic layer deposited WNxCy films on plasma enhanced chemical vapor deposited SiO2 for Cu metallization-Reference-Cited by-同舟云学术

Evaluation of integrity and barrier performance of atomic layer deposited WNxCy films on plasma enhanced chemical vapor deposited SiO2 for Cu metallization

Published:2006-08-21 Issue:8 Volume:89 Page:081913
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Kim Ki-Su,Lee Moon-Sang,Yim Sung-Soo,Kim Hyun-Mi,Kim Ki-Bum,Park Hyung-Sang,Koh Wonyong,Li Wei-Min,Stokhof Maarten,Sprey Hessel

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2338768

Reference16 articles.

1. Diffusion of Metals in Silicon Dioxide

2. Kinetics of copper drift in low-κ polymer interlevel dielectrics

3. M. Ritala and M. Leskelä, in Handbook of Thin Film Materials, edited by H. S. Nalva (Academic, New York, 2002), Vol. 1, p. 135.

4. Growth mechanism and continuity of atomic layer deposited TiN films on thermal SiO2

5. Nucleation and growth of atomic layer deposited HfO2 gate dielectric layers on chemical oxide (Si–O–H) and thermal oxide (SiO2 or Si–O–N) underlayers

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis of high conformalty Ti-Six-N films using (CH3)3CCl and SiH4; density functional theory simulation and film characterization;Thin Solid Films;2024-07

2. Tungsten Carbides;Ultra-High Temperature Materials IV;2022

3. Synthesis of nanostructured tungsten carbonitride (WN x C y ) by carbothermal ammonia reduction on activated carbon and its application in hydrazine decomposition;Catalysis Today;2016-10

4. Structure and mechanical properties of reactive sputtered WCN films;Surface Engineering;2016-03-24

5. Effect of carbon content on structure and properties of WCN coatings prepared by RF magnetron sputtering;Surface and Coatings Technology;2016-02