Correlation between stress voiding of Al(Si)(Cu) metallizations and crystal orientation of aluminum grains
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.354243
Reference4 articles.
1. Understanding Void Phenomena in Metal Lines: Effects of Mechanical and Electromigration Stress
2. Microtexture determination by electron back-scatter diffraction
3. Effects of Film Texture on Electromigration Lifetime Predictions
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