Interface stability and solid-state amorphization in an immiscible Cu–Ta system
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1630353
Reference13 articles.
1. Tantalum as a diffusion barrier between copper and silicon
2. Thermal stability of Cu/Ta/GaAs multilayers
3. Role of Interface in Ion Mixing or Thermal Annealing Induced Amorphization in Multilayers in Some Immiscible Systems
4. Solid-state amorphization at tetragonal-Ta/Cu interfaces
5. Formation of Cu diffusion channels in Ta layer of a Cu/Ta/SiO2/Si structure
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The nucleation and growth mechanism of solid-state amorphization and diffusion behavior at the W–Cu interface;Composites Part B: Engineering;2024-06
2. Deformation Mechanism of Depositing Amorphous Cu-Ta Alloy Film via Nanoindentation Test;Nanomaterials;2022-03-21
3. Investigation of shock front in nanocrystalline CuTa alloy via molecular dynamics method;2021 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO);2021-08-02
4. Numerical simulation study on cooling of metal droplet in atomizing gas;Materials Today Communications;2020-12
5. Wear and Deformation Performance of W/Ta Multilayer Coatings on Pure Cu Prepared by Double Glow Plasma Alloying Technique;Coatings;2020-09-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3