Deformation Mechanism of Depositing Amorphous Cu-Ta Alloy Film via Nanoindentation Test

Author:

Li WeibingORCID,Wang Xiao,Feng XiaobinORCID,Du Yao,Zhang Xu,Xie YongORCID,Chen XiaomingORCID,Lu YangORCID,Wang WeidongORCID

Abstract

As a representative of immiscible alloy systems, the Cu-Ta system was the research topic because of its potential application in industry, military and defense fields. In this study, an amorphous Cu-Ta alloy film was manufactured through magnetron sputter deposition, which was characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Mechanical properties of Cu-Ta film were detected by the nanoindentation method, which show that the elastic modulus of Cu3.5Ta96.5 is 156.7 GPa, and the hardness is 14.4 GPa. The nanoindentation process was also simulated by molecular dynamic simulation to indicate the deformation mechanism during the load-unload stage. The simulation results show that the structure <0,2,8,4> and <0,2,8,5> Voronoi cells decreased by 0.1% at 50 Ps and then remained at this value during the nanoindentation process. In addition, the number of dislocations vary rapidly with the depth between indenter and surface. Based on the experimental and simulation results, the Voronoi structural changes and dislocation motions are the key reasons for the crystallization of amorphous alloys when loads are applied.

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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