Degradation and corresponding failure mechanism for GaN-based LEDs
Author:
Affiliation:
1. Semiconductor lighting Research and Development Center, Institute of Semiconductors, Chinese Academy of Sciences, No.A35, Qinghua East Road, Haidian District, Beijing P R China
Funder
the China International Science and Technology Cooperation Program
National Natural Science Foundation of China (NSFC)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4953056
Reference24 articles.
1. Temperature rise in InGaN/GaN vertical light emitting diode on copper transferred from silicon probed by Raman scattering
2. InGaN-based vertical light-emitting diodes with acid-modified graphene transparent conductor and highly reflective membrane current blocking layer
3. Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes
4. Improved Reliability and ESD Characteristics of Flip-Chip GaN-Based LEDs With Internal Inverse-Parallel Protection Diodes
5. Degradation behavior of GaN-based LEDs encapsulated with different phosphors
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