A laterally excited bulk acoustic resonator with scattering vias in electrodes

Author:

Wen Zhiwei1ORCID,Liu Wenjuan123ORCID,Luo Tiancheng14ORCID,Tong Xin1ORCID,Xie Ying1,Gu Xiyu5ORCID,Liu Yan1ORCID,Cai Yao123ORCID,Guo Shishang5ORCID,Wang Jian6,Sun Chengliang123ORCID

Affiliation:

1. The Institute of Technological Sciences, Wuhan University 1 , Wuhan 430072, China

2. Hubei Yangtze Memory Laboratories 2 , Wuhan 430205, China

3. Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University 3 , Wuhan 430072, China

4. Institute of Materials Research and Engineering, A*STAR (Agency for Science, Technology and Research) 4 , Singapore 138634, Singapore

5. School of Physics and Technology, Wuhan University 5 , Wuhan 430072, China

6. Wuhan MEMSonics New Technologies Co., Ltd 6 ., Wuhan 430070, China

Abstract

Laterally excited bulk acoustic resonators (XBARs) using interdigital electrodes are currently limited in potential 5G applications due to the accompanied spurious modes and small capacitance. This Letter presents an XBAR with scattering vias in electrodes, named SV-BAR. The non-parallel boundaries thoroughly disrupt the coherent formation of standing waves in the lateral direction, thereby suppressing the higher-order spurious modes. The duty factor of SV-BAR is optimized as 0.5 using COMSOL Multiphysics finite element analysis for the 50 Ω impedance matching. The SV-BAR is fabricated using a 390 nm Z-cut LiNbO3 on an insulator substrate and exhibits an impressive ratio of Zp/Zs near 64.5 dB, a Kt2 of 21.80% at 4.762 GHz, as well as a large value f · Bode_Qmax · Kt2 (3.43 × 1011). The measured temperature coefficient of frequency is −69.8 ppm/°C, which can be compensated using SiO2 thin films. The SV-BAR provides an effective solution for high-performance radio frequency filters for 5G communication.

Funder

National Key Research and Development Program of China

Fundamental Research Funds for the Central Universities

Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

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