Growth, physical properties, and adhesion of copper‐polyphenylquinoxaline interfaces
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.357853
Reference17 articles.
1. Phenyl-substituted polyquinoxalines
2. Phenyl-substituted polyquinoxalines
3. Thermal diffusion and ion mixing of the Cu/PPQ system
4. Thermal processing of a copper‐poly(phenyl quinoxaline) interface: Diffusion of the metal in the polymer studied by high resolution electron‐energy‐loss spectroscopy
5. Metal‐polymer interfaces: Adhesion and x‐ray photoemission studies
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surface characterization of a low dielectric constant polymer–SiLK[sup ∗] polymer, and investigation of its interface with Cu;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1999
2. Physical and chemical properties of the chromium/polyphenylquinoxaline interface;Journal of Applied Physics;1998-06-15
3. Study of Energy Gap and Electronic Transitions in Model Polymer Systems: Electronic Versus Optical Excitations;Science and Technology of Polymers and Advanced Materials;1998
4. Interaction between chromium and oxidized polyphenylquinoxaline surfaces;Journal of Applied Physics;1996
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