Thermal diffusion and ion mixing of the Cu/PPQ system-Reference-Cited by-同舟云学术

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Thermal diffusion and ion mixing of the Cu/PPQ system

Published:1992-12 Issue:4 Volume:32 Page:386-389
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Chow J.T.,Zhu B.,Lau S.S.,Cros A.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Polymers in Electronics;Soane,1989

2. Polyimides and other High-temperature Polymers;Bureau,1991

3. A.S.M. International-297;Balde;Electronic Materials Handbook, vol. 1. Packaging,1989

4. Metallized Plastics-2: Fundamental and Applied Aspects,1991

5. Conference on Polymer Solid Interfaces;Gregore,1991

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Growth, physical properties, and adhesion of copper‐polyphenylquinoxaline interfaces;Journal of Applied Physics;1994-07-15

2. Properties of Metal / Polyphenylquinoxaline Interfaces;MRS Proceedings;1994

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