Research on life evaluation method of solder joint based on eddy current pulse thermography
Author:
Affiliation:
1. School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5062850
Reference31 articles.
1. A novel approach for flip chip solder joint inspection based on pulsed phase thermography
2. Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress
3. A proposal of a new material for greenhouses on the basis of numerical, optical, thermal and mechanical approaches
4. Thermographic Non-destructive Evaluation of Carbon Fiber-Reinforced Polymer Plates After Tensile Testing
5. Multidimensional Tensor-Based Inductive Thermography With Multiple Physical Fields for Offshore Wind Turbine Gear Inspection
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