The effect of surface roughness on direct wafer bonding
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.369377
Reference12 articles.
1. Semiconductor wafer bonding: recent developments
2. Thickness Considerations in Direct Silicon Wafer Bonding
3. A model of wafer bonding by elastic accommodation
4. Surface topography and tribology
5. Effect of contact deformations on the adhesion of particles
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