Affiliation:
1. Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, South Korea
Funder
National Research and Development Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT
Technology Innovation Program (Public-Private Joint Investment Semiconductor Research and Development Program
Hybrid Bonding Technologies for 3D Package Interconnects funded by the Ministry of Trade, Industry and Energy (MOTIE), Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Cited by
1 articles.
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