AlN/AlGaN/AlN quantum well channel HEMTs

Author:

Singhal Jashan1ORCID,Kim Eungkyun1ORCID,Hickman Austin2ORCID,Chaudhuri Reet1ORCID,Cho Yongjin1ORCID,Xing Huili Grace134ORCID,Jena Debdeep134ORCID

Affiliation:

1. School of Electrical and Computer Engineering, Cornell University 1 , Ithaca, New York 14853, USA

2. Soctera, Inc. 2 , 350F Duffield Hall, Ithaca, New York 14853, USA

3. Department of Materials Science and Engineering, Cornell University 3 , Ithaca, New York 14853, USA

4. Kavli Institute at Cornell for Nanoscale Science, Cornell University 4 , Ithaca, New York 14853, USA

Abstract

We present a compositional dependence study of electrical characteristics of AlxGa1−xN quantum well channel-based AlN/AlGaN/AlN high electron mobility transistors (HEMTs) with x=0.25,0.44, and 0.58. This ultra-wide bandgap heterostructure is a candidate for next-generation radio frequency and power electronics. The use of selectively regrown n-type GaN Ohmic contacts results in contact resistance that increases as the Al content of the channel increases. The DC HEMT device characteristics reveal that the maximum drain current densities progressively reduce from 280 to 30 to 1.7 mA/mm for x=0.25,0.44, and 0.58, respectively. This is accompanied by a simultaneous decrease (in magnitude) in threshold voltage from −5.2 to −4.9 to −2.4 V for the three HEMTs. This systematic experimental study of the effects of Al composition x on the transistor characteristics provides valuable insights for engineering AlGaN channel HEMTs on AlN for extreme electronics at high voltages and high temperatures.

Funder

National Science Foundation

Energy Frontier Research Centers

Air Force Office of Scientific Research

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

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