Influence of interfacial structural disorder and/or chemical interdiffusion on thermal boundary conductance for Ti/Si and Au/Si couples
Author:
Affiliation:
1. Laboratoire de Métallurgie Mécanique, Ecole Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland
Funder
Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5114671
Reference33 articles.
1. Thermal conductance of interfaces between highly dissimilar materials
2. Molecular-dynamics study of energy flow and the Kapitza conductance across an interface with imperfection formed by two dielectric thin films
3. Role of interface disorder on thermal boundary conductance using a virtual crystal approach
4. Effects of temperature and disorder on thermal boundary conductance at solid–solid interfaces: Nonequilibrium molecular dynamics simulations
5. Interface Structure Influence on Thermal Resistance Across Double-Layered Nanofilms
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