Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management

Author:

Zhang Peijuan,Hao Yuanyuan,Shi Hang,Lu Jiahao,Liu Yingjun,Ming Xin,Wang Ya,Fang Wenzhang,Xia Yuxing,Chen Yance,Li Peng,Wang Ziqiu,Su Qingyun,Lv Weidong,Zhou Ji,Zhang Ying,Lai Haiwen,Gao Weiwei,Xu Zhen,Gao Chao

Abstract

AbstractHighly thermally conductive graphitic film (GF) materials have become a competitive solution for the thermal management of high-power electronic devices. However, their catastrophic structural failure under extreme alternating thermal/cold shock poses a significant challenge to reliability and safety. Here, we present the first investigation into the structural failure mechanism of GF during cyclic liquid nitrogen shocks (LNS), which reveals a bubbling process characterized by “permeation-diffusion-deformation” phenomenon. To overcome this long-standing structural weakness, a novel metal-nanoarmor strategy is proposed to construct a Cu-modified graphitic film (GF@Cu) with seamless heterointerface. This well-designed interface ensures superior structural stability for GF@Cu after hundreds of LNS cycles from 77 to 300 K. Moreover, GF@Cu maintains high thermal conductivity up to 1088 W m−1 K−1 with degradation of less than 5% even after 150 LNS cycles, superior to that of pure GF (50% degradation). Our work not only offers an opportunity to improve the robustness of graphitic films by the rational structural design but also facilitates the applications of thermally conductive carbon-based materials for future extreme thermal management in complex aerospace electronics.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Electronic, Optical and Magnetic Materials

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