Study on the processing characteristics of sapphire wafer polished with different properties plates-Reference-Cited by-同舟云学术

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Study on the processing characteristics of sapphire wafer polished with different properties plates

Published:2022-02-01 Issue:2 Volume:12 Page:025218
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

Lin Chen¹,Xu Yongchao¹^ORCID,Wang Qianting¹

Affiliation:

1. School of Materials Science and Engineering, Fujian University of Technology, Fuzhou 350118, China

Funder

National Natural Science Foundation of China

Distinguished Young Scientific Research Talents Plan in Universities of Fujian Province

Fujian University of Technology

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0083484

Reference31 articles.

1. A novel lapping process for single-crystal sapphire using hybrid nanoparticle suspensions

2. Machine learning application for prediction of sapphire crystals defects

3. Radiation-induced defects in sapphire single crystals irradiated by a pulsed ion beam

4. Effects of polishing parameters on surface quality in sapphire double-sided CMP

5. Enhanced optical output in InGaN/GaN light-emitting diodes by tailored refractive index of nanoporous GaN

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influences of ultrasonic vibration directions, amplitudes, and frequencies on sapphire polishing studied by molecular dynamics;Precision Engineering;2024-09

2. Orthogonal experimental study on the influence of machining parameters on flat lapping of sapphire substrate;AIP Advances;2024-01-01

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