Effects of polishing parameters on surface quality in sapphire double-sided CMP

Author:

Li Zhongyang,Deng Zhaohui,Hu Yangxuan

Funder

Natural Science Foundation of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. Investigation on ultra-precision lapping of A-plane and C-plane sapphires;Wan;Ceram. Int.,2019

2. Study of mechanochemical effect on wear and its application to surface finishing;Yasunaga;Res. Electrotech. Lab.,1977

3. The progress on polishing technology of sapphire substrate used in LED;Zhuo;Mach. Des. Manufact.,2013

4. Preparation of MgO doped colloidal SiO2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate;Yin;Ceram. Int.,2018

5. Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire;Xu;Appl. Surf. Sci.,2015

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